Questar wedge and ball wire bonders target small lots, high variation

April 13, 2011 — Questar Products International, a manufacturer of automatic wire bonders for the global assembly market, released the Q7000 series of fine-pitch, fine-wire (17-75μm), aluminum/gold (Al/Au) automatic wedge and ball bonders to better meet smaller lot size, multiple product variation, frequent set-up change styles of package production.

Click to EnlargeThe Q7000 Series has updated hardware and software, delivering a more tightly integrated assembly package, with approximately 30% fewer components and 50% less wiring than the Q2100 Series, which it replaces. These systems also cost less than the Q2100 models. The machines are designed with off-the-shelf components available directly from suppliers worldwide.

In addition, Questar has simplified the configuration selection process by including previously optional items, such as a programmable ultrasonic generator, as standard features.

Also standard is ball/stud bumping, stitch bonding, and table tear for wedge bonding. The customer chooses the appropriate heated or ambient workholder (and a programmable temperature controller if gold wire is to be used with the Q7800 wedge bonder) when ordering a Q7000 or Q7800 wire bonding system.

These automatic wire bonders support prototyping to medium-volume production. Designed for packaging applications from basic monolithic to complex hybrid devices and custom, specialty systems, the Q7000 series accommodates a multitude of device configurations. Package conversions are reportedly simple and can be completed in minutes.

The new design has also placed all control electronics on the top of the bonders for easier, no-tools-required access.

Questar Products offers hardware and software customization for specialty device applications such as unique wire-shaping and larger bondable area requirements.

Running on the Windows XP Pro operating system, the Q7000 Series offers intuitive, menu-driven software that is easy to program, with convenient access to all machine functions. The user-friendly operator interface provides point-and-click bonding; unlimited wires; easy bond process editing; extensive program storage; and a bond parameter library.

Questar provides wire-bonding machines to the global solid-state component assembly market. For more information on the Q7000 Series, visit

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