May 18, 2011 — Alchimer, nanometric film deposition provider for advanced 3D packaging applications, launched a new wet-deposition process, AquiVantage, that grows interconnect layers for interposer redistribution layers (RDLs) and significantly enhances via-last backside wafer interconnects. The process eliminates 2 costly photolithography steps.
Interposers incorporate a through-silicon vias (TSV) structure, as well as front-side redistribution circuitry (for attachment to the chip stack) and back-side redistribution and bumping (for attachment to the circuit board).
The AquiVantage process provides concurrent wet deposition of TSV and front-side isolation, barrier, and copper fill/RDL, while eliminating CMP and dry deposition steps. It also supports smaller vias with higher aspect ratios.
On the backside, the AquiVantage process allows selective maskless growth of the on-silicon isolation layer, completely eliminating an entire expose/develop/etch/clean lithography-process cycle.
AquiVantage uses the same cost-saving technology as Alchimer’s wet processes for TSVs. It eliminates several process steps, including two costly photolithography steps, in producing high-quality films. By eliminating steps, 3D package interposer costs can be reduced 50%.
AquiVantage technology accommodates thicker wafers, eliminating the need for wafer carriers and allows for highly scalloped via structures and faster etching times.
Alchimer CEO Steve Lerner sees AquiVantage changing business models and fab methods of manufacturing enterprises all along the electronics value chain, including IDMs, OSATs, and foundries.
Alchimer develops and markets innovative chemical formulations, processes and IP for the deposition of nanometric films used in a variety of microelectronic and MEMS applications, including wafer-level interconnects and TSVs for 3D packaging. Visit www.alchimer.com.