Alchimer wet deposition debut targets RDL, other 3D IC processes

May 18, 2011 — Alchimer, nanometric film deposition provider for advanced 3D packaging applications, launched a new wet-deposition process, AquiVantage, that grows interconnect layers for interposer redistribution layers (RDLs) and significantly enhances via-last backside wafer interconnects. The process eliminates 2 costly photolithography steps.

Interposers incorporate a through-silicon vias (TSV) structure, as well as front-side redistribution circuitry (for attachment to the chip stack) and back-side redistribution and bumping (for attachment to the circuit board).

The AquiVantage process provides concurrent wet deposition of TSV and front-side isolation, barrier, and copper fill/RDL, while eliminating CMP and dry deposition steps. It also supports smaller vias with higher aspect ratios.

On the backside, the AquiVantage process allows selective maskless growth of the on-silicon isolation layer, completely eliminating an entire expose/develop/etch/clean lithography-process cycle.

AquiVantage uses the same cost-saving technology as Alchimer’s wet processes for TSVs.  It eliminates several process steps, including two costly photolithography steps, in producing high-quality films. By eliminating steps, 3D package interposer costs can be reduced 50%.

AquiVantage technology accommodates thicker wafers, eliminating the need for wafer carriers and allows for highly scalloped via structures and faster etching times.

Alchimer CEO Steve Lerner sees AquiVantage changing business models and fab methods of manufacturing enterprises all along the electronics value chain, including IDMs, OSATs, and foundries.

Alchimer develops and markets innovative chemical formulations, processes and IP for the deposition of nanometric films used in a variety of microelectronic and MEMS applications, including wafer-level interconnects and TSVs for 3D packaging. Visit www.alchimer.com.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

OEM Group expands P5000 capabilities to compound semiconductor substrates
05/25/2017OEM Group has launched the P5000:CS automated single wafer cluster tool for the compound semiconductor market. ...
3D-Micromac launches the second generation of its high-performance microcell OTF laser systems
04/17/2017The high-performance production solution for Laser Contact Opening (LCO) of PERC solar cells achieves a th...
ULVAC launches NA-1500 dry etching system for 600mm advanced packaging systems
03/24/2017ULVAC, Inc. is pleased to announce the NA-1500 dry etching system for 600mm advanced packaging substrates, providing for u...