Non-planar device scaling: SEMATECH talks TSV, SoC, SiP

May 18, 2011 — For the first time, the semiconductor industry is moving to 3D device structures, such as through silicon vias. This is significantly different than moving to thinner devices, says Raj Jammy, SEMATECH, at The ConFab 2011. He speaks with senior technical editor Debra Vogler.

Conformality of the gate dielectric, conformality of the contacts, and design all come into play. Semiconductor makers must still create robust and high-yield devices to be sucessful.

The biggest challenges for high-volume manufacturing of through silicon vias (TSV), Jammy says, are all through the process flow. Bonding and de-bonding is one major example, with poor throughput. Materials stresses, especially on thinned dies, are another.

SoC technologies are on the verge of some significant changes, Jammy predicts. For example, an entire smartphone could be fit onto one SoC. With system in package (SiP), additional functionality will be integrated, even MEMS devices.

Jammy also reviews SEMATECH’s roadmaps for logic and memory.

Read a summary of Jammy’s ConFab 2011 presentation on new device architectures.

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

NEW PRODUCTS

MKS introduces the I-Series family of high flow mass flow controllers
02/25/2015MKS Instruments, Inc., a global provider of technologies that enable advanced processes and improve productivity, has introduced th...
TMC introduces stage-base 450 with voice coil technology
02/10/2015TMC, a developer of high-performance vibration and motion cancellation technology, has introduced Stage-Base 450, its next generation of frame-m...
Entegris launches Dispense System optimized for 3D and MEMS applications
02/03/2015Entegris, Inc. announced the latest addition to its IntelliGen family of two-stage dispense technologies used in microelectronic...