EVG installs MEMS bonder at Quebec research center

June 28, 2011 — EV Group (EVG), MEMS fab equipment supplier, will install a 200mm Gemini fully automated wafer-bonding system with cleaning module at the MiQro Innovation Collaborative Centre (C2MI) being built in Technoparc Bromont, Quebec, Canada.
 
The Gemini system will be used to develop and manufacture micro electromechanical system (MEMS) devices requiring advanced packaging and full integration with CMOS. The research center aims to successfully transfer designs to high-volume manufacturing (HVM), and as such requires flexible, high-performance equipment, said Luc Ouellet, Teledyne DALSA VP of technology development. EVG’s Gemini will work alongside tools from Alchimer and Akrion, among others.

The 200mm Gemini platform can handle up to 4 pre-processing modules and incorporates EVG’s latest software and control system. The cleaner module will control particulate levels in the tool and assist in post-processing of the wafers. It meets the facility’s aggressive technical specifications, and throughput and productivity requirements. The tool is flexible for the research environment and easily scaled for HVM.

Sucessful device packaging could lead to improved pressure sensors, telecommunications MEMS sensors, inertial sensors, RF MEMS devices, imaging sensors, and microfluidics, among other applications.

EVG has a strong track record with a 150mm system at Teledyne DALSA, noted Steven Dwyer, EV Group VP and GM, North America. The 200mm Gemini will be a version of the Gemini platform (300mm) installed at SEMATECH’s 3D R&D Center in Albany, NY.

The MiQro Innovation Collaborative Centre (C2MI) is an original partnership between Université de Sherbrooke, Teledyne DALSA Inc. and IBM Canada Ltd, Bromont Plant. The C2MI will be an international pioneer in packaging the next generation of microchips and designing packages for future MEMS. Learn more here http://www.electroiq.com/news/2011/06/1436945770/teledyne-dalsa-to-update-on-final-phase-of-innovation-center-at-nanotech-conference-expo-2011.html or visit www.c2mi.ca.
 
EV Group (EVG) serves semiconductor, MEMS and nanotechnology manufacturers with wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. More information is available at www.EVGroup.com.

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