by Michael A. Fury, Techcet Group
June 20, 2011 – Seventy attendees comprised the standing room only crowd at SEMI’s HQ for the special June 15 NCCAVS user group meeting on 3D Packaging, co-hosted by three of the Bay Area User Groups: CMP, Plasma Applications, and Thin Film. The presentations will be posted on one or more of these groups at http://www.avsusergroups.org/ as soon as they are available.
Rob Rhoades, CTO of Entrepix, led off the session with a review of CMP issues unique to through-silicon vias (TSV). Copper is the prevalent choice for TSV metal fill, being used 2