NCCAVS on 3D packaging: Bring on the TSVs

by Michael A. Fury, Techcet Group

June 20, 2011 – Seventy attendees comprised the standing room only crowd at SEMI’s HQ for the special June 15 NCCAVS user group meeting on 3D Packaging, co-hosted by three of the Bay Area User Groups: CMP, Plasma Applications, and Thin Film. The presentations will be posted on one or more of these groups at http://www.avsusergroups.org/ as soon as they are available.

Rob Rhoades, CTO of Entrepix, led off the session with a review of CMP issues unique to through-silicon vias (TSV). Copper is the prevalent choice for TSV metal fill, being used 2

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