NCCAVS on 3D packaging: Bring on the TSVs

by Michael A. Fury, Techcet Group

June 20, 2011 – Seventy attendees comprised the standing room only crowd at SEMI’s HQ for the special June 15 NCCAVS user group meeting on 3D Packaging, co-hosted by three of the Bay Area User Groups: CMP, Plasma Applications, and Thin Film. The presentations will be posted on one or more of these groups at as soon as they are available.

Rob Rhoades, CTO of Entrepix, led off the session with a review of CMP issues unique to through-silicon vias (TSV). Copper is the prevalent choice for TSV metal fill, being used 2


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