Rudolph launches TSV inspection tool, wins first order

June 14, 2011 — Rudolph Technologies, Inc. (NASDAQ: RTEC), process characterization equipment and software provider, debuted the NSX 320 Automated Macro Inspection System for through silicon vias (TSV) and Click to Enlargeother advanced package process inspection, edge trimming metrology, wafer alignment for bonding, and inspection of sawn wafers on film frames and other TSV-related processes. A leading IC manufacturer has ordered the first NSX 320 system.
 
Foundry, IDM, fables, and equipment manufacturer customers helped Rudolph define the TSV inspection requirements, said Rajiv Roy, Rudolph’s vice president of business development and director of back-end marketing.

The system works at production speed. It offers Rudolph’s proprietary XSoft system software capabilities — high-speed staging, on-the-fly image capture and sensor and objective options — as well as the ability to perform critical dimension measurement, 3D sensors for TSV depth/bump metrology, and the ability to flip wafers to allow inspection of front and back surfaces. Macro defects (defects 0.5 micron and larger) created during wafer manufacturing, probing, bumping, dicing, or general handling are quickly detected. 

Rudolph Technologies, Inc. provides design, development, manufacture and support of defect inspection, process control metrology, and data analysis systems and software used by semiconductor device manufacturers worldwide. For more information, visit www.rudolphtech.com

Also readAdvanced packaging collab between Rudolph Technologies, process tool supplier, and IC device manufacturer integrates defect inspection and wafer debonding

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