AMAT deposition and UV curing toolset enables 22nm interconnects

July 12, 2011 — Applied Materials Inc. (AMAT) introduced a toolset for manufacturing low-power, fast interconnects in 22nm and lower logic chips: the Applied Producer Black Diamond 3 deposition system and Applied Producer Nanocure 3 UV curing system. The systems create low-k dielectric films that insulate copper wire interconnects. Applied also debuted a full-vacuum gate stack fab tool today.

The Black Diamond 3 technology, extendible to 14nm, can be integrated into existing process flows. Black Diamond was first introduced for the 90nm node.

Applied’s Black Diamond 3 process creates a dielectric film with uniform porosity. This engineered nano-porosity increases the mechanical strength and hardness of the film, enabling it to withstand the stress of hundreds of downstream processes and packaging steps. The new film also delivers a 2.2 k-value, which reduces parasitic capacitance in interconnects.

The new Applied Producer Nanocure 3 system enhances Applied’s ultraviolet (UV) curing technology for porous low-k films with advancements in UV source optics and chamber design that provide up to 50% more uniform curing than conventional processes. The Nanocure 3 employs a high intensity UV source with a low pressure curing process that results in 40% faster curing. Combined with the Black Diamond 3 film, this two-step deposition and cure process provides up to twice the mechanical strength of Applied’s successful second generation Black Diamond film, reducing device variability and boosting chip yield.

Applied Materials will showcase the breakthrough Black Diamond 3 and Nanocure 3 technologies at Semicon West in San Francisco from July 12-14. Read more product news from SEMICON West.

Applied Materials Inc. (Nasdaq:AMAT) provides equipment, services and software to advanced semiconductor, flat panel display and solar photovoltaic manufacturers. Learn more at

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