Canon enters back-end packaging market with lithography tool debut

July 8, 2011 — Canon Inc. made its first foray into the semiconductor back-end packaging equipment market with the new FPA-5510iV for through silicon via (TSV) and bump lithography.

The Canon FPA-5510iV semiconductor lithography tool uses technologies from Canon’s FPA-5500iZ front-end tool series, with high resolution, high throughput, and high overlay accuracy to accomodate TSV and bump structures.

Resist film for TSVs and bumps is relatively thick. Canon equipped the tool with an optimized Numerical Aperture for the thickness with a pattern size of one to several tens of microns. It realizes small and deep vertical holes in the thick resist. The Numerical Aperture is adjustable to handle various patterns, controlling the image depth of focus, resolution and resist profile.

The FPA-5510iV features a large exposure area and high-intensity light exposure. The system’s projection lens optics expose 52 x 34 mm, compared with the 26 x 33 mm area exposed by front-end tools, and the illumination optics utilize a 4.5kW high-intensity lamp as the light source.

Canon makes lithography systems for LCD and semiconductor manufacturing. Learn more at

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