LED packaging equipment debuts at ESI booth: Via drilling and wafer scribing tools

July 14, 2011 — ESI Inc. (Nasdaq:ESIO), laser-based manufacturing equipment supplier, uncrated the Model 5390 micromachining system for advanced LED via drilling and the AccuScribe 2600 LED wafer scribing system at SEMICON West.

The Model 5390 laser-based micromachining system creates electrical interconnections on LED packages, optimizing via placement accuracy.

It uses ESI’s high-speed compound beam positioner coupled with a high-power CO2 laser, enabling user-definable variable pulse width and pulse repetition frequencies of up to 300kHz. The system can produce more than 100 vias per second in typical single layer dielectric materials.

The first Model 5390 has shipped to an LED manufacturer.

ESI’s AccuScribe 2600 is built for high brightness LED (HB-LED) manufacturing, scribing patterned sapphire substrate (PSS), distributed Bragg reflector (DBR), metal mirror (MM) and other advanced wafers. HB-LEDs change LED architecture and manufacturing processes, said Jonathan Sabol, general manager of ESI’s LED


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