MHI 8″ wafer bonder produces 3D LSI ICs at room temp with FAB gun

July 13, 2011 – JCN Newswire — Mitsubishi Heavy Industries Ltd. (MHI) developed a fully automated 8" wafer bonding machine that bonds large-scale integration (LSI) circuits at room temperature, creating 3D ICs. Its fast atom beam (FAB) gun irradiates atoms to activate material surface bonding.

Previous room-temperature wafer bonding systems used ion guns, which could not acheive 8" wafer bonding. Whereas an ion gun radiates an argon ion beam, a FAB gun radiates a neutral atom beam of argon, which acheives about 20x greater energy per particle. The FAB gun removes oxide films on the bonding metal material’s surface. MHI’s supporting beam radiation technology also helps evenly activate the entire 8" wafer. Results show robust metallic electrode bonding for 3D integrated LSI circuits.

The process works with silicon and various metals. By eliminating heat stresses, the machine makes a wider range of materials available for 3D packaging. The room temperature process leads to a rigid, reliable bond in less time than a heat/cool process.

The system’s cassette holds 20 8" wafers and can perform wafer conveying and alignment for bonding automatically. The machine set preliminary bonding conditions for each wafer individually in high mix environments.

MHI is now looking to develop this technology for 12" wafers.

Mitsubishi Heavy Industries, Ltd. (TSE: 7011, ‘MHI’) makes heavy machinery. For more information, please visit the MHI website at www.mhi.co.jp.

Subscribe to Solid State Technology/Advanced Packaging.

Follow Advanced Packaging on Twitter.com by clicking www.twitter.com/advpackaging. Or join our Facebook group

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

NEW PRODUCTS

Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...
MKS introduces the Cirrus 3-XD Atmospheric gas analysis system
03/10/2015MKS Instruments, Inc., a global provider of technologies that enable advanced processes and improve productivity, has introduced the Cirru...