August 17, 2011 — The annual Known Good Die (KGD) conference will address semiconductor die testing, assembly, manufacturing, and business challenges, with the tagline "KGD in an Era of Multi-Die Packaging and 3D Integration." The KGD Conference takes place November 10 in Santa Clara, CA.
The event is co-located with another MEPTEC event, "2.5D, 3D and Beyond: Bringing 3D Integration to the Packaging Mainstream," set for November 9.
"Multi-function 3D, vertically stacked or multichip packages" are increasingly incorporated into mobile consumer products, such as tablets and smartphones, notes Jonathan Davis, president of the Semiconductor Business Unit at SEMI, which co-presents KGD with MEPTEC. Complex package configurations rely heavily on KGD to meet functionality, time-to-market, and cost goals.
For 18 years, the KGD conference has marshaled technical experts, managers and business development professionals from around the world for an interactive exchange on the latest developments in the die product industry.
The KGD conference sessions will cover such topics as KGD test, handling, delivery, standards, current methods, options and infrastructure.
For more information on the Known Good Die conference, visit: http://meptec.org/meptecknowngoodd.html.
SEMI is a global industry association serving the manufacturing supply chains for the microelectronic, display and photovoltaic industries. For more information, visit http://www.semi.org.
MEPTEC provides a forum for semiconductor packaging and test professionals to learn and exchange ideas that relate to assembly, test and handling. For more information, visit http://meptec.org/.