MEMS, 3D packaging major factors in iNEMI roadmap

August 16, 2011 — The 2011 iNEMI Roadmap, published by the International Electronics Manufacturing Initiative (iNEMI), includes a new chapter on micro electro mechanical systems (MEMS) and sensors, and an expanded chapter on packaging to include substrates discussions.

This issue also includes more input from international (outside of North America) participants than in prior years.

MEMS devices are expected to see exponential growth, expanding into sensors, fluidics, RF components, expanded gyroscope capabilities for motion-gesture sensors, and more applications. This variety is impeding standardization in the MEMS sector. Different functionality needs push MEMS devices into customization more than standardization. Scalable manufacturing processes, packaging technologies, cost-effective and non-destructive test technologies are needed, as well as a better basic understanding of MEMS failure mechanisms. Resonator performance must also be improved.

3D packaging affects a broad range of electronics manufacturing operations, and is discussed in many areas of the Roadmap. Increased momentum in the move toward 3D packaging — through-silicon vias (TSV), thinner die, high-density interconnect (HDI), die shrinkage, embedded actives and passives — creates issues up and down the supply chain, affecting assembly processes and equipment, design and simulation tools, reliability methodologies, thermal management strategies and cooling technologies, and test and inspection strategies.

The Roadmap also acknowledges ongoing challenges for R&D funding, resulting partially from an electronics industry move from vertically integrated OEMs to a multi-firm, globally distributed supply chain. IC assembly, passive components, and electronics manufacturing services have "critical need" for research and development. Industry collaboration is gaining traction in university R&D centers, industry consortia, ad-hoc cross-company development teams, and other areas. Government, academia and industry consortia will need to formulate ways to adopt and develop emerging technologies within the global outsourcing environment.

The more than 575 individuals who contributed to the 2011 Roadmap represent over 310 corporations, consortia/associations, government agencies and universities, located in 18 countries.  The 2011 Roadmap is free for iNEMI members and is for sale to non-members, with special discounted pricing available for universities, research institutions, government agencies and non-profit organizations. For the first time, individual chapters are available for sale and can be purchased on, and downloaded from, the iNEMI website. The 1800-page document features 27 chapters that provide in-depth discussion of six product sectors and 21 different manufacturing, component/subsystem, business process and design technologies. For information about purchasing options and pricing, go to  

The International Electronics Manufacturing Initiative


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>



New AFM with high definition electrical measurement capabilities
04/16/2015The Nano-Observer, designed by Concept Scientific Instruments, is ideal for current and future AFM research applications....
Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...