EVG enhances fusion wafer bonder throughput, accuracy

September 7, 2011 – PRNewswire — Wafer bonding tool maker EV Group (EVG) launched a new flagship model in the GEMINI FB fusion wafer bonding family. The GEMINI FB increases system throughput 26% to 18-20 wafers per hour (WPH) with enhanced automation capabilities, suiting wafer bond tasks in backside illuminated (BSI) CMOS image sensors, 3D integration of CMOS image sensors, and monolithic 3D integration of memory devices.

The upgrade is part of EVG’s plans to implement 300mm Prime standards across its equipment platforms. A local material buffer more than doubles the number of front opening unified pods (FOUPs) on the system — 10 FOUPs enable continuous-mode operation. A faster wafer handling system in the GEMINI FB platform uses double-end effectors on the robotic system rather than single-end effectors.

Low-temperature plasma activation enables wafer bonding and stress/damage free annealing below 400

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