EVG enhances fusion wafer bonder throughput, accuracy

September 7, 2011 – PRNewswire — Wafer bonding tool maker EV Group (EVG) launched a new flagship model in the GEMINI FB fusion wafer bonding family. The GEMINI FB increases system throughput 26% to 18-20 wafers per hour (WPH) with enhanced automation capabilities, suiting wafer bond tasks in backside illuminated (BSI) CMOS image sensors, 3D integration of CMOS image sensors, and monolithic 3D integration of memory devices.

The upgrade is part of EVG’s plans to implement 300mm Prime standards across its equipment platforms. A local material buffer more than doubles the number of front opening unified pods (FOUPs) on the system — 10 FOUPs enable continuous-mode operation. A faster wafer handling system in the GEMINI FB platform uses double-end effectors on the robotic system rather than single-end effectors.

Low-temperature plasma activation enables wafer bonding and stress/damage free annealing below 400

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

New AFM with high definition electrical measurement capabilities
04/16/2015The Nano-Observer, designed by Concept Scientific Instruments, is ideal for current and future AFM research applications....
Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...