Unisem installs Verigy tester for wireless products

September 7, 2011 – BUSINESS WIRE — Unisem installed a V93000 Port Scale RF tester from Verigy, an Advantest Group company (TSE:6857, NYSE:ATE), at its European test development center in Wales. Unisem will test and develop wireless radio frequency (RF) and complex mixed-signal semiconductors on the test platform.

The Verigy V93000 Port Scale RF system suits high-volume testing of wireless devices for mobile computing applications including consumer electronics. It features parallel test capability with high multi-site efficiency, and Verigys pin-scale digital cards. Unisem can utilize the tester for low-integration devices such as power amplifiers, tuners and transceivers up to high-integration RF devices containing integrated mixed-signal, digital, power management and embedded or stacked memory.

The tester enables Unisem to pursue "new markets" in Europe and with its Asia factories, said Andy Perry, general manager, Unisem Europe. The Wales facility is Unisem’s European development center for production-proofing semiconductor assembly and test strategies. Customers can then ramp to high-volume in Unisem’s Asia factories as required.

Verigy provides advanced semiconductor test systems for design validation, characterization, and high-volume manufacturing test. Additional information about Verigy, an Advantest Group company, can be found at www.verigy.com. Information about Advantest can be found at www.advantest.com.

Unisem is a global semiconductor assembly and test services (SATS) provider offering wafer bumping, wafer probing, wafer grinding, a wide range of leadframe and substrate IC packaging, wafer-level CSP and RF, analog, digital and mixed-signal test services and turnkey services. See www.unisemgroup.com.

Subscribe to Solid State Technology/Advanced Packaging.

Follow Advanced Packaging on Twitter.com by clicking www.twitter.com/advpackaging. Or join our Facebook group


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>


Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...
MKS introduces the Cirrus 3-XD Atmospheric gas analysis system
03/10/2015MKS Instruments, Inc., a global provider of technologies that enable advanced processes and improve productivity, has introduced the Cirru...