Ushio 200mm litho tool suits 3D packaging steps

September 7, 2011 — Ushio Inc. debuted a 200mm wafer full-field projection lithography (FFPL) tool UX4-3Di FFPL 200 for high-volume manufacturing of advanced large scale integration (LSI) devices incorporating 3D integration technologies, such as through-silicon vias (TSV) and silicon interposers and bumps.

View the system through a panel display at SEMICON Taiwan 2011, September 7-9 at Taipei World Trade Center in Taipei, Taiwan (Booth #3042).

The UX4-3Di FFPL 200 is mounted with a full-field projection lens of 200mm in diameter on the common UX4 Series modular platform. It handles conversions for 200mm wafers automatically, with a modular platform for future full-field projection on 300mm wafers.

The noncontact tool prevents mask damage. It boasts large depth of focus and high-irradiance optics to handle thick photoresist film. IR alignment is optimized for manufacturing 3D LSIs, and the alignment technology tracks low-visibility alignment marks. A special wafer chuck allows imaging and vacuum contact with warped or bonded wafers. Throughput peaks at 120 wafers per hour (WPH).

Ushio asserts that the full-field projection technology reduces cost-of-operation (CoO) in the semiconductor packaging lithography process.

USHIO is also developing a lens module that allows full-field projection of a 300mm wafer, to be released in 2012.

View the UX4-LEDs Product Data Sheet at

Ushio Inc. offers light source units, devices, systems and light solutions. Learn more at

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