Ziptronix low-temp direct oxide bonding scales pixels to 0.7

September 27, 2011 — Ziptronix announced just before SEMICON Taiwan that its low-temperature direct oxide bonding technology — Zibond, used for constructing backside-illuminated (BSI) structures in image sensors — was licensed by Sony. In a podcast interview with ElectroIQ.com, Ziptronix president & CEO, Daniel Donabedian, and company CTO, Paul Enquist, discussed both the wafer bonding technology and what the Sony deal means in the podcast below.


 

Because adhesives do not have high bonding energy at low temperatures, the result is high distortion, therefore, these materials are not usable for scaling smaller pixel sizes, said Enquist. Conversely, the company

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

NEW PRODUCTS

Entegris announces GateKeeper GPS platform
07/15/2014Entegris, Inc., announced last week the launch of GateKeeper GPS, its next-generation of automated regeneration gas purification system (GPS) technology....
Bruker introduces Inspire nanoscale chemical mapping system
07/15/2014Bruker today announced the release of Inspire, the first integrated scanning probe microscopy (SPM) infrared system for 10-nanometer spatial...
MEMS wafer inspection system from Sonoscan
06/25/2014Sonoscan has announced its AW322 200 fully automated system for ultrasonic inspection of MEMS wafers....