Ziptronix low-temp direct oxide bonding scales pixels to 0.7

September 27, 2011 — Ziptronix announced just before SEMICON Taiwan that its low-temperature direct oxide bonding technology — Zibond, used for constructing backside-illuminated (BSI) structures in image sensors — was licensed by Sony. In a podcast interview with ElectroIQ.com, Ziptronix president & CEO, Daniel Donabedian, and company CTO, Paul Enquist, discussed both the wafer bonding technology and what the Sony deal means in the podcast below.


 

Because adhesives do not have high bonding energy at low temperatures, the result is high distortion, therefore, these materials are not usable for scaling smaller pixel sizes, said Enquist. Conversely, the company

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