Ziptronix low-temp direct oxide bonding scales pixels to 0.7

September 27, 2011 — Ziptronix announced just before SEMICON Taiwan that its low-temperature direct oxide bonding technology — Zibond, used for constructing backside-illuminated (BSI) structures in image sensors — was licensed by Sony. In a podcast interview with ElectroIQ.com, Ziptronix president & CEO, Daniel Donabedian, and company CTO, Paul Enquist, discussed both the wafer bonding technology and what the Sony deal means in the podcast below.


 

Because adhesives do not have high bonding energy at low temperatures, the result is high distortion, therefore, these materials are not usable for scaling smaller pixel sizes, said Enquist. Conversely, the company

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

Compact point of use fluid delivery heater replaces multiple components in a system
07/22/2015Watlow, a designer and manufacturer of complete thermal systems, announces its new point-of-use fluid delivery heater...
New fiber optic temperature sensing and control system ideal for RF environments
07/22/2015Watlow, a designer and manufacturer of complete thermal systems, announced its new EZ-ZONE RM fiber optic temperature me...