Fraunhofer IZM’s packaging center installs Altatech CVD

October 11, 2011 — All Silicon System Integration Dresden (ASSID), a microelectronics packaging center under the Fraunhofer IZM Institute, installed a single-wafer, multi-chamber AltaCVD 300 from Altatech Semiconductor in its 970sq.m. Dresden cleanroom.

ASSID started pilot production of 3D ICs using the 300mm chemical vapor deposition (CVD) tool. The AltaCVD 300 deposits conformal dielectric liners inside through silicon vias (TSV) in die stacks for 3D ICs and system-in-packages (SiP). TSV aspect ratios are up to 10:1, with hole diameters as small as 10

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

NEW PRODUCTS

SEMI-GAS Xturion Blixer enables on-site blending of forming gas mixtures
10/03/2017The Blixer provides a cost-effective alternative to purchasing expensive pre-mixed gas cylinders by enabling operators to blend ...
Automated thickness measurement system speeds production
09/20/2017ACU-THIK is an automated thickness measurement tool incorporating dual contact probes for high accuracy inspection of semiconductor wafers....
3D-Micromac launches the second generation of its high-performance microcell OTF laser systems
04/17/2017The high-performance production solution for Laser Contact Opening (LCO) of PERC solar cells achieves a th...