Fraunhofer IZM’s packaging center installs Altatech CVD

October 11, 2011 — All Silicon System Integration Dresden (ASSID), a microelectronics packaging center under the Fraunhofer IZM Institute, installed a single-wafer, multi-chamber AltaCVD 300 from Altatech Semiconductor in its 970sq.m. Dresden cleanroom.

ASSID started pilot production of 3D ICs using the 300mm chemical vapor deposition (CVD) tool. The AltaCVD 300 deposits conformal dielectric liners inside through silicon vias (TSV) in die stacks for 3D ICs and system-in-packages (SiP). TSV aspect ratios are up to 10:1, with hole diameters as small as 10

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

Edwards launches new vacuum pumps at SEMICON China 2016
03/15/2016Edwards announced the availability of two new vacuum pump product families at SEMICON China: the iXM Series for semiconductor etch and chemical v...
Low-outgassing Faraday Isolators to improve lifetime and reliability of optical systems
02/18/2016Qioptiq, an Excelitas Technologies company introduces the LINOS Low-outgassing Faraday Isolators, the first of th...
Versatile high throughput SEM from JEOL
11/04/2015JEOL's new JSM-IT100 is the latest addition to its InTouchScope Series of Scanning Electron Microscopes....