October 11, 2011 — All Silicon System Integration Dresden (ASSID), a microelectronics packaging center under the Fraunhofer IZM Institute, installed a single-wafer, multi-chamber AltaCVD 300 from Altatech Semiconductor in its 970sq.m. Dresden cleanroom.
ASSID started pilot production of 3D ICs using the 300mm chemical vapor deposition (CVD) tool. The AltaCVD 300 deposits conformal dielectric liners inside through silicon vias (TSV) in die stacks for 3D ICs and system-in-packages (SiP). TSV aspect ratios are up to 10:1, with hole diameters as small as 10