IMAPS semiconductor packaging award bestowed on Nordson Asymtek’s Adamson

October 14, 2011 — Steven J. Adamson, marketing specialist with dispensing/coating/jetting equipment maker Nordson ASYMTEK, received the Daniel C. Hughes, Jr., Memorial Award, for the greatest contribution to IMAPS and the microelectronics packaging industry, including technical and service contributions.

The International Microelectronics And Packaging Society (IMAPS) is dedicated to the advancement and growth of microelectronics and electronics packaging. Adamson received the award during the IMAPS conference in Long Beach, CA this week.

Adamson chaired the San Diego IMAPS chapter for 2 years, was general chairman of the 2006 International Symposium on Microelectronics, and served as IMAPS president in 2008. In 2009, he volunteered to be chairman of the IMAPS Microelectronic Foundation, which helps students and academia participate in IMAPS activities through grants and awards. In 2010, Adamson received the IMAPS President’s Award.

Adamson accepted the award with an acknowledgement of the importance of IMAPS to students — with funding, paper publicity, event travel — and the importance of students to IMAPS.

Adamson is a 30+ year veteran in microelectronics assembly, working at Nordson ASYMTEK since 1998, as well as time at Kodak, Motorola, PLessey, International Computers Ltd.

Bio:
Adamson has held positions at Nordson Asymtek as applications engineering manager, and marketing specialist. He has worked in all aspects of packaging and assembly from R&D to manufacturing, designing multi-chip modules, hybrid circuits, printed circuit boards, thermal printed heads, and magneto-resistive head assemblies. He has delivered technical papers on wire bond encapsulation, chip scale package and flip chip assembly, PCB design rules, and reliability and has had papers published in leading industry trade journals both domestically and internationally. He is co-author with Charles Harper on a book titled, "Handbook of Plastic Processes," published by McGraw-Hill.

Adamson previously held positions with Kodak, Motorola in the U.S., and Plessey, International Computers Ltd in the U.K.  He has been awarded five US and two UK patents. In 2005 he was presented with an award by the San Diego Engineering Council for "Outstanding Service to Electrical Engineering". Originally from the U.K., he holds a Higher National Certificate in Electrical Engineering from Stockport College of Technology and for several years was the lead instructor and advisor to the University of California San Diego (UCSD) extension course on Microelectronic and Optical Packaging.  

IMAPS leads the microelectronics packaging, interconnect and assembly community, providing means of communicating, educating and interacting at all levels. Find out more at www.imaps.org.

Nordson ASYMTEK makes precision automated fluid dispensing, conformal coating, and jetting technologies. For more information, visit NordsonASYMTEK.com

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