November 29, 2011 — Dainippon Screen Mfg. Co. Ltd. developed the DW-3000 direct imaging exposure system for next-generation semiconductor packaging, exposing complex 3D multilayer substrates while adjusting for warping and distortion of individual wafers. The DW-3000 exposure system images wiring patterns directly onto wafers.
With the system release, Dainippon Screen will enter the semiconductor post-processing exposure system market. The company makes this move based on the trends of thinned wafers and high-density, multi-chip packaging with fine-pitch interconnects. This means minute warping and distortion occurs very easily and improving the precision of the wiring patterns bridging the chips has become a key issue. This is being undertaken as part of the FRONTIER project for promoting the development of new fields for Screen