Dainippon Screen develops maskless direct imaging exposure system

November 29, 2011 — Dainippon Screen Mfg. Co. Ltd. developed the DW-3000 direct imaging exposure system for next-generation semiconductor packaging, exposing complex 3D multilayer substrates while adjusting for warping and distortion of individual wafers. The DW-3000 exposure system images wiring patterns directly onto wafers.

With the system release, Dainippon Screen will enter the semiconductor post-processing exposure system market. The company makes this move based on the trends of thinned wafers and high-density, multi-chip packaging with fine-pitch interconnects. This means minute warping and distortion occurs very easily and improving the precision of the wiring patterns bridging the chips has become a key issue. This is being undertaken as part of the FRONTIER project for promoting the development of new fields for Screen


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>



Edwards launches new Smart Thermal Management System at SEMICON Europa 2016
10/25/2016Smart TMS helps semiconductor, flat panel display and solar manufacturers improve their process performance and safety by red...
Tektronix introduces Keithley S540 power semiconductor test system
10/19/2016Tektronix, Inc., a worldwide provider of measurement solutions, today introduced the Keithley S540 Power Semiconductor Test System, a ...
Novel Wafer Analyzer for up to 300mm wafer using high speed Raman Imaging Technology
08/08/2016Nanophoton introduces RAMANdrive - a new Wafer Analyzer - for a wide range of applications at semiconductor market a...