EVG moves Chinese SOI bonder customer to full automation

November 10, 2011 — Shanghai Simgui Technology Co. Ltd., a leading Chinese wafer manufacturer, placed a follow-on order for an EV Group (EVG) EVG850 automated production bonding system for silicon-on-insulator (SOI) and direct wafer bonding. Simgui is moving from EVG’s semi-automated wafer bonder to advance high-volume SOI production.

Simgui is a spin-off from Shanghai Institute of Microsystem and Information Technology (SIMIT). It will transfer a well-established production process to the fully automated system. Currently, the company uses an EVG301 single wafer cleaning system with pre-bonding and IR inspection station.

SOI wafers are used to make micro electro mechanical systems (MEMS) and microprocessors, as well as other microelectronics.

This order comes on the heels of another EVG install in China: new customer Shenyang Silicon Technology Co. Ltd. (SST) purchased an EVG850LT automated production bonding system for silicon-on-insulator (SOI) wafers in its state-of-the-art SOI production facility this March.

EV Group recently introduced its 450mm SOI wafer bonder.

EV Group (EVG) makes wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. More information is available at www.EVGroup.com.

Subscribe to our MEMS Direct newsletter

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

ClassOne introduces new mid-sized electroplater
07/06/2015Semiconductor equipment manufacturer ClassOne Technology has announced a new addition to its popular Solstice family of ≤200mm wafer electroplaters....
New AFM with high definition electrical measurement capabilities
04/16/2015The Nano-Observer, designed by Concept Scientific Instruments, is ideal for current and future AFM research applications....
Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...