November 10, 2011 — Shanghai Simgui Technology Co. Ltd., a leading Chinese wafer manufacturer, placed a follow-on order for an EV Group (EVG) EVG850 automated production bonding system for silicon-on-insulator (SOI) and direct wafer bonding. Simgui is moving from EVG’s semi-automated wafer bonder to advance high-volume SOI production.
Simgui is a spin-off from Shanghai Institute of Microsystem and Information Technology (SIMIT). It will transfer a well-established production process to the fully automated system. Currently, the company uses an EVG301 single wafer cleaning system with pre-bonding and IR inspection station.
This order comes on the heels of another EVG install in China: new customer Shenyang Silicon Technology Co. Ltd. (SST) purchased an EVG850LT automated production bonding system for silicon-on-insulator (SOI) wafers in its state-of-the-art SOI production facility this March.
EV Group (EVG) makes wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. More information is available at www.EVGroup.com.