Silex MEMS TSV tech licensed to Nanoshift

November 2, 2011 – PRNewswire — MEMS foundry Silex Microsystems licensed its Silex Sil-Via through-silicon-via (TSV) packaging platform to Nanoshift for use in early development of complex MEMS products.

Silex Sil-Via license agreements allow customers to take complex MEMS devices from prototype to volume production faster, said Peter Himes, vice president of marketing and strategic alliances for Silex Microsystems. Through the Silex Sil-Via license, Nanoshift can bring customer designs to market faster, reducing development time and project risk. Transition to full-scale production on Silex’s 6" or 8" wafer fab lines will be "seamless."

Nanoshift chose the Silex Sil-Via platform because it has been "proven in many high-volume [MEMS] applications," said Salah Uddin, co-founder of Nanoshift.

Silex Sil-Via is a proprietary technology for through silicon via (TSV) interconnects: a full-wafer thickness via comprised of a DRIE etched post surrounded by an isolating material. The resulting interconnect is low impedance, mechanically robust, and avoids the thermal mismatch of metal-based via technologies. Silex brought it into production in 2006 and it has been used on over 100 designs. It can be implemented for wafer-level packaging (WLP) as well as MEMS interconnects.

Silex Microsystems is the world’s largest pure-play MEMS foundry. For more information, please visit

Nanoshift LLC is a privately held design and development company that specializes in emerging technologies. For more information, please visit

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