Bond shear inspection and 300mm wafer handling integration enables Class-2 cleanliness

December 15, 2011 – Marketwire — CHAD Industries integrated its WaferMate300-1 automated wafer handling workcell with Nordson DAGE’s 4300 Bond Shear inspection tool, allowing for hands-off 300mm handling and bond shear inspection.

The system automatically delivers 300mm wafers to the bond shear test tool. The entire system is enclosed for operator safety & clean wafer handling (Class-2), and includes factory automation features (E84 and E87) for automated FOUP delivery to the workcell. SECS/GEM communications and integrated RFID features ensures that the correct wafer lot is being inspected, and allows the wafer inspection data to be uploaded to the factory host computer without manual intervention.

CHAD Industries designs, manufactures, and markets odd-form electronics assembly equipment, automated solar cell manufacturing systems, and semiconductor wafer handling solutions. Learn more at

Nordson DAGE is a unit of the Nordson Corporation and manufactures and supports a complete range of award winning digital X-ray inspection systems and bond test equipment for the printed circuit board assembly and semiconductor industries. For more information, visit

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