December 1, 2011 — Dainippon Screen Mfg. Co., Ltd. has developed a scrubber-type SS-3200 single wafer cleaning system with up to 800 wafers per hour capacity and highly stable processing.
The SS-3200 targets next-generation semiconductor manufacturing of dense, compact parts for mobile electronics with 10nm circuit line widths, as well as multi-layer circuits.
The system uses Dainippon Screen’s rapid wafer transfer system and a new control program to attain 800 WPH without any increase in the number of cleaning chambers from the traditional model. (By comparison, the Nikkei daily reports a similar system from Tokyo Electron tops out at 500 substrates/hour.) The 8-chamber tool claims excellent operability, easy maintenance, and cost-efficiency with reduced energy consumption (the Nikkei reports up to 50% less), the company claims.
The SS-3200 will be on display at SEMICON Japan 2011, held at Makuhari Messe in Chiba, Japan, December 7-9. Pricing for the system starts at