EVG doubles process module space in XT Frame platform

December 5, 2011 – PRNewswire — EV Group (EVG), wafer bonding and lithography equipment supplier, introduced the XT Frame equipment platform for better process throughput and tool functionality. The platform will be used for all high-volume manufacturing tool offerings.

The XT Frame can accommodate up to 9 process modules, twice EVG’s previous maximum processing capability, on a smaller overall footprint. Greater flexibility enables more process module combinations on the single tool platform, and parallel processing of several wafers. The platform boasts an ultra-fast handling system for high-volume frontend wafer processing steps. Up to 4 front opening unified pod (FOUP) load ports can be used. A local FOUP storage system (LFSS) acts as buffer. Upgradeability, and serviceability are reportedly improved.

"Greater-volume manufacturing" is a trend for advanced packaging and 3D interconnect, which led EVG to launch the XT Frame equipment platform on its EVG850TB/DB system, said Paul Lindner, executive technology director for EV Group. The EVG850TB/DB toolset performs automated temporary bonding and debonding as well as wafer bond metrology. Demo capabilities for the XT Frame are now available on the EVG850TB/DB, which can also accommodate EVG’s new EZR (Edge Zone Release) and EZD (Edge Zone Debond) modules to support ZoneBOND technology.

Products built on the new XT Frame platform are available immediately.

EVG’s standard equipment platform has also just recently been upgraded to provide enhanced automation capabilities and increased system throughput, as seen in the relaunch of the GEMINI FB fusion wafer bonder family at SEMICON Taiwan 2011.

EVG will be exhibiting at SEMICON Japan, December 7-9, at booth #6B-606 in Chiba, Japan.

More SEMICON Japan debuts:

EV Group (EVG) makes wafer-processing products for semiconductor, MEMS and nanotechnology applications. More information is available at www.EVGroup.com.

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