ITRI brings 3D packaging expertise to Rambus partnership

December 15, 2011 — Licensing company Rambus Inc. (Nasdaq:RMBS) is engaging with the Industrial Technology Research Institute (ITRI) in Taiwan on the development of interconnect and 3D packaging technologies.

Initially, the companies will collaborate on the development of system integration using silicon interposer technology. Rambus joined the Advanced Stacked-System Technology and Application Consortium (Ad-STAC), a multinational research association led by ITRI. As Ad-STAC members, Rambus and ITRI will share ITRI

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