ITRI brings 3D packaging expertise to Rambus partnership

December 15, 2011 — Licensing company Rambus Inc. (Nasdaq:RMBS) is engaging with the Industrial Technology Research Institute (ITRI) in Taiwan on the development of interconnect and 3D packaging technologies.

Initially, the companies will collaborate on the development of system integration using silicon interposer technology. Rambus joined the Advanced Stacked-System Technology and Application Consortium (Ad-STAC), a multinational research association led by ITRI. As Ad-STAC members, Rambus and ITRI will share ITRI

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

Versatile high throughput SEM from JEOL
11/04/2015JEOL's new JSM-IT100 is the latest addition to its InTouchScope Series of Scanning Electron Microscopes....
Versatile high throughput SEM from JEOL
11/04/2015JEOL's new JSM-IT100 is the latest addition to its InTouchScope Series of Scanning Electron Microscopes....
Greenpeak and Dusan Launch Smart Parking system
09/14/2015GreenPeak Technologies and Dusun Electron Ltd recently announced a partnership with the launch of their first Smart City assisted parking application tha...