Microcapsules give a new take on “self-healing” chips

December 26, 2011 - A group from the U. of Illinois has devised a new chip structure that identifies and patches flaws in semiconductors within seconds, saving much analysis and manual fixing and sparing otherwise functioning chips from the trash heap. The work is detailed in a paper published in the journal Advanced Materials.

Enabling devices with multiple complex functionalities means packing multiple complex chips into more complex packages and assemblies — making it increasingly difficult to find and fix any problems, e.g. failure attributed to temperature cycles or fatigue. Any failure anywhere in the circuit can shut down an entire device. In a fab, such reliability testing often means dumping chips that might otherwise be salvageable. "In a multilayer integrated circuit, there’s no opening it up. Normally you just replace the whole chip," points out materials science and engineering professor Nancy Sottos. Intelligently improving reliability and repairs has been long explored, including chip designs that diagnose component wear and automatically reroute functionality.

But a new approach aims to solve the problem directly without such circumnavigation. Adapting its previous work in self-healing polymer materials to conductive systems, this Illinois group placed tiny microcapsules (~10

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

New AFM with high definition electrical measurement capabilities
04/16/2015The Nano-Observer, designed by Concept Scientific Instruments, is ideal for current and future AFM research applications....
Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...