December 12, 2011 — SEMI is looking for presenters for technical sessions and other opportunities at SEMICON West 2012, July 10-12 in San Francisco, CA.
SEMICON West 2012 will feature more than 40 hours of technical sessions and presentations across three show floor technology stages — the TechXPOTs — focused on critical industry topics shaping design and manufacturing of semiconductors, high-brightness (HB) LEDs, MEMS, printed and flexible electronics, and other related technologies.
SEMI is soliciting technical presentations in topic areas including:
- Emerging Architectures for Logic and Memory
- Advanced Materials and Productivity Solutions
- Advanced Lithography
- Probe Card/Handlers
- Semiconductor Test Strategies
- Adaptive Test
- Contemporary Packaging Technology and Productivity Solutions
- New Packaging Solutions
- Packaging Materials
- Trends and Opportunities in 3D-IC
- Testability and Thermal Management of 3D-IC
- Interposer Solutions for Packaging
- Opportunities in MEMS
- High-brightness LED Manufacturing
- OLED Manufacturing
- Printed and Flexible Electronics
Submit an abstract (maximum 500 words) focused on the latest developments and innovations in these technology areas, inclusive of supporting data. The deadline for abstract submission is March 15, 2012. Submissions may be made online from the SEMICON West 2012 website at: www.semiconwest.org/Participate/SPCFP.
SEMICON West is an event for the display of new products and technologies for microelectronics design and manufacturing, featuring technologies from across the microelectronics supply chain, from electronic design automation, to device fabrication (wafer processing), to final manufacturing (assembly, packaging, and test), as well as emerging technologies. For more information on SEMICON West 2012, please visit: www.semiconwest.org
SEMI is the global industry association serving the nano- and micro-electronics manufacturing supply chains. For more information, visit www.semi.org.