TEL’s 3D packaging tool suite unveiled

December 6, 2011 — Tokyo Electron Limited (TEL) launched a suite of 3D packaging tools: the Tactras FAVIAS through silicon via (TSV) deep-silicon etch system; the TELINDY PLUS VDP polyimide film formation production equipment that uses vapor deposition polymerization technology; and the wafer bonder/debonder Synapse Series.

The Tactras FAVIAS deep silicon etch system is designed to improve mask selectivity for steady etching. It raises plasma density, increasing the etch rate from 10 to 15

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

NEW PRODUCTS

Entegris announces GateKeeper GPS platform
07/15/2014Entegris, Inc., announced last week the launch of GateKeeper GPS, its next-generation of automated regeneration gas purification system (GPS) technology....
Bruker introduces Inspire nanoscale chemical mapping system
07/15/2014Bruker today announced the release of Inspire, the first integrated scanning probe microscopy (SPM) infrared system for 10-nanometer spatial...
MEMS wafer inspection system from Sonoscan
06/25/2014Sonoscan has announced its AW322 200 fully automated system for ultrasonic inspection of MEMS wafers....