TEL’s 3D packaging tool suite unveiled

December 6, 2011 — Tokyo Electron Limited (TEL) launched a suite of 3D packaging tools: the Tactras FAVIAS through silicon via (TSV) deep-silicon etch system; the TELINDY PLUS VDP polyimide film formation production equipment that uses vapor deposition polymerization technology; and the wafer bonder/debonder Synapse Series.

The Tactras FAVIAS deep silicon etch system is designed to improve mask selectivity for steady etching. It raises plasma density, increasing the etch rate from 10 to 15


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