December 14, 2011 — Semiconductor packaging materials will be a $22.8 billion market this year, and should grow to $25.7 billion by 2015, says SEMI and TechSearch International.
Laminate substrates remain the largest segment of packaging materials: $9.7 billion globally in 2011. This sector will see healthy 8% growth (unit basis) in a 5-year compound annual growth rate (CAGR).
New materials are pushing higher growth in certain areas, including underfill materials, wafer-level dielectrics, copper bonding materials, and leadframe chipscale packaging (CSP), among others.
Key opportunities for growth in the packaging market include 9