Underfill, wafer-level dielectrics, Cu-compatible resins among packaging material winners

December 14, 2011 — Semiconductor packaging materials will be a $22.8 billion market this year, and should grow to $25.7 billion by 2015, says SEMI and TechSearch International.

Laminate substrates remain the largest segment of packaging materials: $9.7 billion globally in 2011. This sector will see healthy 8% growth (unit basis) in a 5-year compound annual growth rate (CAGR).

New materials are pushing higher growth in certain areas, including underfill materials, wafer-level dielectrics, copper bonding materials, and leadframe chipscale packaging (CSP), among others.

Key opportunities for growth in the packaging market include 9


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