January 3, 2012 – BUSINESS WIRE — Enpirion, Inc. entered into a strategic partnership agreement with JiangyinChangdian Advanced Packaging Co., Ltd. (JCAP) for the manufacturing of silicon-based magnetics utilizing Enpirion’s proprietary micro electronic magnetic silicon (MEMS) technology. Earlier in 2011, Enpirion demonstrated that its MEMS technology achieved all necessary application performance figures-of-merit at record frequencies of 18 MHz in its DC-DC power system-on-chip (PowerSoC). This announcement marks another key milestone in Enpirion’s leadership and commercialization efforts using low-cost silicon-based magnetics partnering with JCAP with its specialized, high volume wafer level packaging manufacturing capabilities. JCAP is implementing and fully qualifying Enpirion’s innovative magnetic material processes.
"I am happy to announce our collaboration with JCAP on the integration of Enpirion’s advanced MEMS technology into JCAP’s innovative wafer level manufacturing operations," said Denis Regimbal, CEO of Enpirion. "Since the company’s inception, we have invested heavily in developing silicon-based magnetic technologies that complement our high frequency CMOS power technology. This will permit Enpirion to continue to extend its leadership in integrated DC-DC power solutions by penetrating into new applications such as cost-effective LDO replacements."
Lai Chih-Ming, President of JCAP said: "We are excited to have been selected by Enpirion, the leader in integrated power management, to bring to market this advanced technology for magnetic materials on silicon wafers for the first time in power applications using our world renowned, innovative, high volume wafer level bump and chip scale manufacturing processes. Clearly this next generation technology will deliver the first low cost, fully integrated DC-DC converter on silicon. We look forward to growing this business with Enpirion."
Enpirion, the leading provider of integrated power management solutions, simplifies design complexity while addressing the space constraint and efficiency needs faced by designers of enterprise, telecom,storage, industrial and embedded applications. For more information about Enpirion, please visit www.enpirion.com .
JiangyinChangdian Advanced Packaging Co., Ltd. (JCAP) is a subsidiary of Jiangsu Changjiang Electronics Technology Co., Ltd. (JCET) a leading manufacturer of discrete semiconductor devices, the largest indigenous packaging subcontractor for discrete and IC packaging assembly and test in mainland China. For more information about JCAP, please visit www.jcap.cn