3M debuts high-capacitance ECM for IC packaging, RF, other apps

February 2, 2012 – BUSINESS WIRE — 3M launched a high-capacitance Embedded Capacitance Material (ECM), targeting improved power integrity and reduced electromagnetic interference (EMI) for small form factor computer hardware, high-performance RF boards, microphones, integrated circuit (IC) packaging, and consumer electronics. The ECM material contributes to hi-fidelity signals, high-signal-to-noise ratio in radio frequencies, and higher speed digital signals.

Previous 3M ECM versions have a maximum capacitance density of approximately 10nF/inch2. The 3M ECM High-Capacitance Density products offer a 20-40nF/inch2 capacitance density range. The ECM material is halogen-free and RoHS compliant.

Also read: 3M, IBM to make 3D chip adhesives

The material matches the needs of increased fidelity and rapid miniaturization in electronic devices, said Abhay Joshi, global business development manager, 3M Electronic Solutions Division, Interconnect Business.



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