JPSA expands Ultrafast laser machining technology

February 8, 2012 — JP Sercel Associates, Inc. (JPSA), advanced laser micro machining provider, expanded its Ultrafast processing capabilities, using Pico-second lasers with innovative laser beam delivery techniques. The technology is used for high-volume production of light-emitting diodes (LED), semiconductors, solar products, and bio-medical devices.

The Pico-second laser systems operate at wavelengths ranging from UV to IR (355-1064nm) for precision machining, cutting, and hole drilling, with minimized thermal effects. JPSA Pico-second laser systems provide high peak energy intensity, resulting from the short pulse duration. JPSA’s proprietary beam delivery technologies speed the Pico-second laser machining throughputs up to 10X.

JPSA shipped its first IX-6168 Micromachining System configured with a Pico-second laser and Galvanometer to a manufacturer. The tool can cut, drill holes and vias, apply texture, ablate or pattern thin films, and machine 3D features.

JPSA supplies industrial grade UV excimer, DPSS, and Pico-second laser micromachining systems and materials processing services. Learn more at

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