LED packaging report reveals costs, reliability impact of package

February 24, 2012 — With thermal issues accounting for half of all lighting failures, and costs too high for widespread adoption, assembly and packaging are keys to improving light emitting diodes (LEDs). In "High Brightness LED Assembly Trends, Materials and Issues," consulting firm TechSearch International tracks LED packaging materials and methods, as well as reliability and package efficiency. The report reviews high-brightness LED assembly trends and issues, materials used today, and requirements for the future. Critical issues, including thermal and optical, are addressed.

Packaging materials significantly affect the optical efficiency of LEDs. Reflectivity, transmissivity, and index of refraction can affect the lumens output. Thermal issues account for as much as 50% of the failures in lighting. Packaging material stability (encapsulants and lenses) is also affected by exposure to elevated temperatures, UV, and other wavelength radiation.

There are no standard LED packages. The variety of materials selected, packaging methods, and ultimately reliability make cost-reduction a complex decision-making process.

In the report, TechSearch International shares examples of various packages for high-brightness LEDs to illustrate the diversity in package options.

TechSearch International

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

NEW PRODUCTS

Spectral reflectometer for film thickness measurement
04/08/2014Verity Instruments, Inc. is pleased to announce the availability of its new SP2100 Spectral Reflectometer designed for film thickness measurement f...
New Kimtech Pure G3 EvT nitrile gloves
04/03/2014Kimberly-Clark Professional has introduced a new glove that is designed to provide process protection for the semiconductor and electronics industries....
UVOTECH releases UV-Ozone Cleaning System
04/03/2014Using a UV-Ozone Cleaner, near atomically clean surfaces can be achieved in minutes without any damage to your devices. ...