February 15, 2012 — Electronics materials supplier Engineered Material Systems released the DA-5045-2 and DA-5045-4 high-thermal-conductivity die attach adhesives for light emitting diodes (LEDs) and small power semiconductor die packaging.
The new thermally and electrically conductive adhesives enable high thermal transfer for LEDs and power electronics. Thermal conductivities are greater than 20 W/mK when measured by laser flash. Both products feature high glass transition temperatures (Tg) and modulus, enabling wire bonding. They are electrically conductive for static drain. DA-5045-2 and -4 withstand JEDEC level 1/260