February 21, 2012 — Electronics System Integration Technology Conference (ESTC) 2012 seeks original papers describing research in all areas of electronic packaging, including LED packaging, flexible electronics, assembly and interconnect technologies, and more. ESTC takes place September 17-20 in Amsterdam, the Netherlands. Organized by IEEE-CPMT since 2006, in association with IMAPS-Europe, the ESTC conference series focuses on interconnect and packaging technologies for electronic system integration. Submit your abstract by April 1.
Paper abstracts may be submitted to the following tracks and application areas:
- Assembly and Manufacturing Technology
- Materials for Interconnect and Packaging
- Embedded Die and Wafer Level Packaging
- 3D Integration Technology
- Microsystem Packaging
- Flexible and Stretchable electronics
- Advanced and Emerging Technologies
- Power Electronic Packaging
- Optoelectronic Packaging
- Thermal and Mechanical Modeling
- Electrical Design & Modeling
- Consumer Electronics
- Automotive and Industrial Electronics
- Avionics and Space Electronics
- Medical Electronics
- Solid State Lighting
- Telecom System Electronics
- Wireless Electronics
- RF-ID and Smartcards
- Display and Imager Electronics
- Energy System Electronics
Submit a 300-500 word abstract that describes the scope, content and key points of your proposed paper. Abstracts must include results and graphics. Please visit www.estc2012.eu to upload your abstract. Submissions for poster presentations are also welcome. Submission deadline for abstracts is April 1, 2012.
ESTC will select the best paper and best poster presentations. For each, the author(s) will receive a personalized ESTC award and a monetary prize from the IEEE-CPMT Region 8 Director.
The official language of all presentations is English. All oral and poster presentation authors are invited to prepare a paper for the conference proceeding which will also be included in the IEEE XPLORE database after the conference.
Your submission must include the mailing address, business telephone number and email address of the presenting author and affiliations of all authors. All submitted abstracts will be reviewed by the committee to ensure a high-quality conference. At the discretion of the program committee, paper abstracts submitted may be considered for poster presentation. The work should be original and not previously published, and avoid inclusion of commercial content. Additional instructions about formatting the paper will be published on www.estc2012.eu.
Selected presenters will be notified on June 1, 2012. Final paper manuscript will then be due August 15, 2012.
Related story: Advanced packaging at the 2010 ESTC