Semiconductor industry expectations for 2012: Take the WWK survey

February 17, 2012 — Wright Williams & Kelly, Inc. (WWK), a cost & productivity management software and consulting services company, opened its 2012 semiconductor industry survey on equipment and process timing. Only participants will receive the full results, free of charge. Download the survey form at  
The 2011 survey found double patterning lithography, through silicon vias (TSVs) and TSVs with copper fill, and high-k metal gate (HKMG) with HfO2 and ZrO2 likely technologies to be implemented on semiconductor fab lines in 2012.

Other expectations from the semiconductor industry included remote tool diagnostic capability from their equipment suppliers; manufacturing capacity, utilization and cycle time simulation; and implementation of 300mm prime advances.
Respondents did not expect to see 193 high-index immersion, direct-write, extreme ultra-violet (EUV), or imprint lithography in production until 2015 or later.

Take the 2012 survey:
Wright Williams & Kelly Inc. is an operational cost management software and consulting company serving technology-dependent and technology-driven organizations. WWK maintains long-term relationships with prominent industry resources including SEMATECH, SELETE, Semiconductor Equipment and Materials International (SEMI), and national labs and universities.  Its client base includes nearly all of the top 20 semiconductor manufacturers and equipment and materials suppliers as well as leaders in nanotechnology, micro-electro-mechanical systems (MEMS), thin film record heads, magnetic media, flat panel displays (FPD), solid state lighting/light emitting diodes (SSL/LED), and photovoltaics (PV).

Subscribe to Solid State Technology


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>



New AFM with high definition electrical measurement capabilities
04/16/2015The Nano-Observer, designed by Concept Scientific Instruments, is ideal for current and future AFM research applications....
Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...