DOW CMP slurry boasts lower defects and better removal rates

March 21, 2012 — Dow Electronic Materials, a business unit of The Dow Chemical Company (NYSE:DOW), released KLEBOSOL II 1730 colloidal silica slurry for chemical mechanical polishing/planarization (CMP).

The slurry demonstrates a 50% reduction in defects for inter-layer dielectrics (ILD) and can increase removal rates by up to 10% over previous generations. It is tailored for ILD and post-metal buff applications.

KLEBOSOL II 1730 slurry features a new elongated abrasive particle morphology that reportedly improves slurry utilization, since it is dilutable with lower point-of-use (POU) solids. It offers comparable planarization efficiency to fumed silica slurries and high removal rates. It can be combined with Dow’s CMP pads for longer life in the wafer fab. KLEBOSOL II 1730 boasts 0 agglomeration and accepts 0.3um POU filtration capability.

Dow Electronic Materials is a global supplier of materials and technologies to the semiconductor, interconnect, finishing, photovoltaic, display, LED and optics markets. Dow (NYSE:DOW) is a science and technology company. More information about Dow can be found at www.dow.com.

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