Interposer supply/ecosystem examined at IMAPS Device Packaging

March 12, 2012 — At the recent IMAPS Device Packaging Conference in Ft McDowell, AZ, Solid State Technology’s Insights from the Leading Edge (IFTLE) brought together a panel of manufacturers, users and market specialists to discuss the Evolving 2.5D / 3D Infrastructure.

Panel host and Solid State Technology contributing editor Phil Garrou was joined by Douglas Yu, Sr Director of front end and back end technology development for TSMC; Jonathon Greenwood, Director of Packaging R&D at GlobalFoundries; Remi Yu, Deputy Division Director of UMC; Nick Kim, VP of electronic packaging technologies at Hynix; Rich Rice, Sr VP of sales for ASE ; Ron Huemoeller, VP of Advanced 3D interconnect at Amkor; Matt Nowak, Sr Director of Engineering at Qualcomm and Jan Vardaman, President of TechSearch Inc.

Photo [l to r]: Yu (TSMC), Garrou (IFTLE), Huemoeller (Amkor), Vardaman (TechSearch), Greenwood (GlobalFoundries), Yu (UMC), Kim (Hynix), Nowak (Qualcomm), Rice (ASE).

 

While TSV technology appears to be stabilizing…

Panelists were unanimous in their descriptions of mainstream 3D packaging being represented by 5-8

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