Interposer supply/ecosystem examined at IMAPS Device Packaging

March 12, 2012 — At the recent IMAPS Device Packaging Conference in Ft McDowell, AZ, Solid State Technology’s Insights from the Leading Edge (IFTLE) brought together a panel of manufacturers, users and market specialists to discuss the Evolving 2.5D / 3D Infrastructure.

Panel host and Solid State Technology contributing editor Phil Garrou was joined by Douglas Yu, Sr Director of front end and back end technology development for TSMC; Jonathon Greenwood, Director of Packaging R&D at GlobalFoundries; Remi Yu, Deputy Division Director of UMC; Nick Kim, VP of electronic packaging technologies at Hynix; Rich Rice, Sr VP of sales for ASE ; Ron Huemoeller, VP of Advanced 3D interconnect at Amkor; Matt Nowak, Sr Director of Engineering at Qualcomm and Jan Vardaman, President of TechSearch Inc.

Photo [l to r]: Yu (TSMC), Garrou (IFTLE), Huemoeller (Amkor), Vardaman (TechSearch), Greenwood (GlobalFoundries), Yu (UMC), Kim (Hynix), Nowak (Qualcomm), Rice (ASE).

 

While TSV technology appears to be stabilizing…

Panelists were unanimous in their descriptions of mainstream 3D packaging being represented by 5-8

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

Automated thickness measurement system speeds production
09/20/2017ACU-THIK is an automated thickness measurement tool incorporating dual contact probes for high accuracy inspection of semiconductor wafers....
3D-Micromac launches the second generation of its high-performance microcell OTF laser systems
04/17/2017The high-performance production solution for Laser Contact Opening (LCO) of PERC solar cells achieves a th...
ULVAC launches NA-1500 dry etching system for 600mm advanced packaging systems
03/24/2017ULVAC, Inc. is pleased to announce the NA-1500 dry etching system for 600mm advanced packaging substrates, providing for u...