March 12, 2012 — At the recent IMAPS Device Packaging Conference in Ft McDowell, AZ, Solid State Technology’s Insights from the Leading Edge (IFTLE) brought together a panel of manufacturers, users and market specialists to discuss the Evolving 2.5D / 3D Infrastructure.
Panel host and Solid State Technology contributing editor Phil Garrou was joined by Douglas Yu, Sr Director of front end and back end technology development for TSMC; Jonathon Greenwood, Director of Packaging R&D at GlobalFoundries; Remi Yu, Deputy Division Director of UMC; Nick Kim, VP of electronic packaging technologies at Hynix; Rich Rice, Sr VP of sales for ASE ; Ron Huemoeller, VP of Advanced 3D interconnect at Amkor; Matt Nowak, Sr Director of Engineering at Qualcomm and Jan Vardaman, President of TechSearch Inc.
|Photo [l to r]: Yu (TSMC), Garrou (IFTLE), Huemoeller (Amkor), Vardaman (TechSearch), Greenwood (GlobalFoundries), Yu (UMC), Kim (Hynix), Nowak (Qualcomm), Rice (ASE).|
While TSV technology appears to be stabilizing…
Panelists were unanimous in their descriptions of mainstream 3D packaging being represented by 5-8