March 9, 2012 — Kulicke & Soffa Industries Inc. (K&S, NASDAQ:KLIC) launched the LUMOS Capillary for light-emitting diode (LED) die wire bonding. The capillary can bond with gold or gold-alloy wires and uses a new TG ceramic material for better workability.
The LUMOS is designed for LED packaging specifically, targeting better bond quality and more stable process, permitting lower level of assist and higher productivity throughout the bonding process. Its fine granular tip surface morphology helps maintain excellent second bonds over a longer bonding time.
The LUMOS Capillary will debut at the Semicon China show at the Shanghai New International Expo Centre from March 20-22, 2012. Also at K&S’ booth: New AccuPlus Hub Blades for discrete semiconductor dicing and the ConnX Plus high-speed ball bonder for low-pin-count semiconductor packaging.
Kulicke & Soffa (NASDAQ: KLIC) designs and manufactures semiconductor and LED assembly equipment. Internet: www.kns.com.