Kulicke & Soffa semiconductor wafer dicing blades tuned for discretes

March 9, 2012 — Kulicke & Soffa Industries Inc. (K&S, NASDAQ:KLIC) launched its AccuPlus Hub Blades product line, customizable blades for discrete wafer dicing.  

Discrete semiconductors are fabbed on thinned wafers, and die sizes are generally small. This presents die movement and blade loading challenges at the wafer dicing step, notes K&S.

To prevent die chipping and cracks during wafer dicing, key blade elements were optimized: diamond grit size, diamond concentration, and nickel bond hardness. The blades boast a shortened pre-cut process, two special nickel bond hardness series, multi-levels of diamond concentration, and a special hub material and design for high spindle frequency with lower vibration.

The Discrete Series


Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>


Entegris announces GateKeeper GPS platform
07/15/2014Entegris, Inc., announced last week the launch of GateKeeper GPS, its next-generation of automated regeneration gas purification system (GPS) technology....
Bruker introduces Inspire nanoscale chemical mapping system
07/15/2014Bruker today announced the release of Inspire, the first integrated scanning probe microscopy (SPM) infrared system for 10-nanometer spatial...
MEMS wafer inspection system from Sonoscan
06/25/2014Sonoscan has announced its AW322 200 fully automated system for ultrasonic inspection of MEMS wafers....