Micro glass drilling enables 0.1mm semiconductor interposers

March 8, 2012 — AGC (Asahi Glass Co. Ltd.) developed ultra-high-speed processing technology for micro hole drilling of 0.1mm-thin glass, targeting leading-edge applications such as 3D semiconductor packages.

Ultra-thin glass has prospects for being applied to various products thanks to its thinness of 0.1mm in addition to the excellent features of glass including transparency, heat resistance and electrical insulation. Last year, AGC developed the thinnest (0.1mm) float glass, but these were difficult to process using ordinary processing methods, which led to this new drilling technology

AGC developed the micro hole drilling processing technology using a dielectric breakdown induced by electrical discharging. This technology has enabled precise drilling processing on ultra-thin glass with a very high processing speed, in the order of a few milliseconds.

This technology can be applied, for instance, to hole drilling processing of thin sheet glass for interposers for laminated stacked-die packages with interposers. This interposer needs many holes with a diameter of about 50

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