Micro glass drilling enables 0.1mm semiconductor interposers

March 8, 2012 — AGC (Asahi Glass Co. Ltd.) developed ultra-high-speed processing technology for micro hole drilling of 0.1mm-thin glass, targeting leading-edge applications such as 3D semiconductor packages.

Ultra-thin glass has prospects for being applied to various products thanks to its thinness of 0.1mm in addition to the excellent features of glass including transparency, heat resistance and electrical insulation. Last year, AGC developed the thinnest (0.1mm) float glass, but these were difficult to process using ordinary processing methods, which led to this new drilling technology

AGC developed the micro hole drilling processing technology using a dielectric breakdown induced by electrical discharging. This technology has enabled precise drilling processing on ultra-thin glass with a very high processing speed, in the order of a few milliseconds.

This technology can be applied, for instance, to hole drilling processing of thin sheet glass for interposers for laminated stacked-die packages with interposers. This interposer needs many holes with a diameter of about 50

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

NEW PRODUCTS

Automated thickness measurement system speeds production
09/20/2017ACU-THIK is an automated thickness measurement tool incorporating dual contact probes for high accuracy inspection of semiconductor wafers....
3D-Micromac launches the second generation of its high-performance microcell OTF laser systems
04/17/2017The high-performance production solution for Laser Contact Opening (LCO) of PERC solar cells achieves a th...
ULVAC launches NA-1500 dry etching system for 600mm advanced packaging systems
03/24/2017ULVAC, Inc. is pleased to announce the NA-1500 dry etching system for 600mm advanced packaging substrates, providing for u...