Shin-Etsu Chemical joins EVG wafer bonding supply chain

March 14, 2012 – PRNewswire — EV Group (EVG), semiconductor and MEMS fab equipment supplier, welcomed semiconductor materials supplier Shin-Etsu Chemical Co. Ltd. into its open platform for temporary bonding/debonding (TB/DB) materials supporting 3D semiconductor packaging. Shin-Etsu will work with customers to commercialize 3D IC packaging via wafer bond/debond in volume manufacturing environments.

Shin-Etsu’s advanced adhesives will be qualified with EVG’s EZR (Edge Zone Release) and EZD (Edge Zone Debond) process modules for ZoneBOND room-temperature debonding. Shin-Etsu MicroSi, a wholly owned subsidiary of Shin-Etsu Chemical, has worked closely with EVG’s process development teams to perform stringent test procedures for EVG ZoneBOND equipment.

A strong supply chain for temporary thin-wafer bonding is one step in "the advancement of 3D IC commercialization," noted Markus Wimplinger, EVG’s corporate technology development and IP director. Also read: EVG launches ZoneBond-capable modules and Brewer Science, EVG commercialize temporary wafer bonding with zoning laws

EVG offers ZoneBOND technology, EZR (Edge Zone Release), and EZD (Edge Zone Debond) modules for temporary wafer bonding, thin wafer processing, and debonding applications. The company touts its ability to use silicon, glass and other carriers; compatibility with existing, field-proven adhesive platforms; and the ability to debond at room temperature with virtually no vertical force applied to the device wafer. Strong adhesion occurs at the edge (perimeter) and minimal adhesion is applied to the wafer center, supporting grinding and backside processing at high temperatures and low-force carrier separation.

Shin-Etsu Chemical Co. Ltd. supplies semiconductor materials, semiconductor silicon, PVC resin, synthetic quartz glass and methylcellulose and materials including silicones and rare earth magnets. Shin-Etsu Chemical’s stock (TSE: 4063) is listed on three markets: The Tokyo, Osaka and Nagoya Exchanges in Japan. Internet: http://www.shinetsu.co.jp

Shin-Etsu MicroSi Inc. is a wholly owned subsidiary of Shin-Etsu Chemical Co. Ltd., providing materials and other products for photolithography, packaging, solar and flexible printed circuit applications. Internet: www.microsi.com.

EV Group (EVG) makes wafer-processing equipment for semiconductor, MEMS and nanotechnology applications.  Products include wafer bonding, lithography/nanoimprint lithography (NIL) and metrology equipment, as well as photoresist coaters, cleaners and inspection systems. More information is available at www.EVGroup.com.

Subscribe to Solid State Technology

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

OEM Group expands P5000 capabilities to compound semiconductor substrates
05/25/2017OEM Group has launched the P5000:CS automated single wafer cluster tool for the compound semiconductor market. ...
3D-Micromac launches the second generation of its high-performance microcell OTF laser systems
04/17/2017The high-performance production solution for Laser Contact Opening (LCO) of PERC solar cells achieves a th...
ULVAC launches NA-1500 dry etching system for 600mm advanced packaging systems
03/24/2017ULVAC, Inc. is pleased to announce the NA-1500 dry etching system for 600mm advanced packaging substrates, providing for u...