SUSS combines resist coat and develop platforms

March 19, 2012 — Semiconductor fab equipment supplier SUSS MicroTec launched the RCD8 manual resist coat and develop platform for R&D and low-volume use in micro electro mechanical system (MEMS), semiconductor packaging, light-emitting diode (LED) and other applications.

The RCD8 can convert from a spin coater, with the proprietary GYRSET closed cover coating technology, to a spray developer. The convertion takes minutes. Install options range from basic manual operation to semi-automated to puddle & spray developer.

The processes developed on the manual RCD8 are easily transitioned to a SUSS MicroTec production tool.

The RCD8 combines SUSS’ multiple dedicated Delta Series tools that served specific applications in MEMS, advanced packaging, and LED fab or the R&D market. All necessary coating and developing processes for these applications are incorporated.

The GYRSET rotating closed cover coating option can be integrated into the RCD8 spin coating module to widen the process window and reduce consummables use on various photoresists and applications. GYRSET allows square substrates and pieces to be coated with a homogenous resist thickness.

Various options can be added in the field to adapt with process changes. The RCD8 hosts a large variety of available chucks and configurations.

SUSS MicroTec, listed on TecDAX of Deutsche Boerse AG, is a leading supplier of equipment and process solutions for microstructuring in the semiconductor industry and related markets. For more information, please visit http://www.suss.com.

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