Die attach adhesive suits temperature-sensitive electronics

April 12, 2012 — Adhesives maker DELO introduced DELOMONOPOX die attach adhesives, promising strong mechanical/environmental protection, low-temperature cure, and compatibility with various chip packaging substrates.

The DELOMONOPOX adhesive family for die attach adhere to all smart card substrates including silicon, epoxy and gold, as well as new substrates, such as PEI, PET and PEN. DELOMONOPOX adhesives cure in seconds at low temperatures.

When used for bonding and encapsulating chips in smart card modules, the adhesives mechanically safeguard the chips and the contacting area from pressure, bending and torsion. They also protect the die from physical influences and environmental conditions such as humidity, cold or heat.

DELO

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

NEW PRODUCTS

MKS introduces the I-Series family of high flow mass flow controllers
02/25/2015MKS Instruments, Inc., a global provider of technologies that enable advanced processes and improve productivity, has introduced th...
TMC introduces stage-base 450 with voice coil technology
02/10/2015TMC, a developer of high-performance vibration and motion cancellation technology, has introduced Stage-Base 450, its next generation of frame-m...
Entegris launches Dispense System optimized for 3D and MEMS applications
02/03/2015Entegris, Inc. announced the latest addition to its IntelliGen family of two-stage dispense technologies used in microelectronic...