Ferro expands LTCC offering with cost-sensitive materials set

April 3, 2012 — Ferro Electronic Materials expanded its low temperature co-fired ceramic (LTCC) portfolio, adding a line of cost-effective matched materials. The L8 LTCC system claims better performance over a greater range of frequencies and easier manufacturability than market alternatives.

The L8 LTCC system’s dielectric properties provide lower loss than competitive, price-sensitive LTCC products, Ferro reports, enabling lower-power components. L8 performs well at up to 40GHz (see the figure below). The lead-free, RoHS-compliant glass-ceramic formulation provides high strength and may be used in wire-bond, solderable, brazable, and plateable packaging applications.

Ferro supplies L8 ceramic tape with a full complement of matched metallization pastes that include silver, gold, plateable silver, and mixed-metal formulations. Gold and nickel may be electrolessly plated onto silver surfaces to improve performance in harsh environments and for easier wire bonding. L8 pastes have good printability and the material set has a broad processing window with multiple co-firing options with either belt or box furnaces.     

The L8 system is suitable for cost-sensitive low- to mid-frequency telecommunications, automotive, and medical modules, components and sensors as well as higher frequency aerospace, satellite and other high-reliability applications.

Learn more about the Ferro L8 LTCC product line in booth 9-212 at SMT Hybrid Packaging 2012, May 8-10 in Nuremberg, Germany.

Ferro Corporation is a global supplier of technology-based performance materials for manufacturers in electronics, solar, and other end markets. Learn more at http://www.ferro.com.

Subscribe to Solid State Technology

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <s> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

OEM Group expands P5000 capabilities to compound semiconductor substrates
05/25/2017OEM Group has launched the P5000:CS automated single wafer cluster tool for the compound semiconductor market. ...
3D-Micromac launches the second generation of its high-performance microcell OTF laser systems
04/17/2017The high-performance production solution for Laser Contact Opening (LCO) of PERC solar cells achieves a th...
ULVAC launches NA-1500 dry etching system for 600mm advanced packaging systems
03/24/2017ULVAC, Inc. is pleased to announce the NA-1500 dry etching system for 600mm advanced packaging substrates, providing for u...