GLOBALFOUNDRIES installs TSV fab tools for 20nm stacked die

April 26, 2012 — At its Fab 8 in Saratoga County, NY, GLOBALFOUNDRIES is installing a special set of semiconductor production tools to create through-silicon vias (TSV) in 20nm node semiconductor wafers. 3D die stacking of leading-edge chips will enable mobile and consumer electronics. The first full-flow silicon with TSVs is expected to start running at Fab 8 in Q3 2012.

GLOBALFOUNDRIES is working with partners to develop packaging processes on advanced silicon nodes, said Gregg Bartlett, CTO, GLOBALFOUNDRIES, noting the complexity of chip/package interactions in next-generation nodes and the scaling alternative offered by 3D integration. The 20nm TSV capabilities at Fab 8 are supplemented by GLOBALFOUNDRIES

POST A COMMENT

Easily post a comment below using your Linkedin, Twitter, Google or Facebook account. Comments won't automatically be posted to your social media accounts unless you select to share.

Leave a Reply

Your email address will not be published. Required fields are marked *

You may use these HTML tags and attributes: <a href="" title=""> <abbr title=""> <acronym title=""> <b> <blockquote cite=""> <cite> <code> <del datetime=""> <em> <i> <q cite=""> <strike> <strong>

LIVE NEWS FEED

NEW PRODUCTS

Thin wafer processing temporary bonding adhesive film for 3D wafer integration
03/24/2015 AI Technology, Inc (AIT) is the first known provider of a film format high temperature temporary bonding adhesive for thi...
Dramatic results achieved in cleaving glass using ultra-short pulsed lasers
03/11/2015ROFIN-SINAR, Inc. introduces the SmartCleave FI laser process and the MPS glass handling system for high speed and precise cl...
MKS introduces the Cirrus 3-XD Atmospheric gas analysis system
03/10/2015MKS Instruments, Inc., a global provider of technologies that enable advanced processes and improve productivity, has introduced the Cirru...