GLOBALFOUNDRIES installs TSV fab tools for 20nm stacked die

April 26, 2012 — At its Fab 8 in Saratoga County, NY, GLOBALFOUNDRIES is installing a special set of semiconductor production tools to create through-silicon vias (TSV) in 20nm node semiconductor wafers. 3D die stacking of leading-edge chips will enable mobile and consumer electronics. The first full-flow silicon with TSVs is expected to start running at Fab 8 in Q3 2012.

GLOBALFOUNDRIES is working with partners to develop packaging processes on advanced silicon nodes, said Gregg Bartlett, CTO, GLOBALFOUNDRIES, noting the complexity of chip/package interactions in next-generation nodes and the scaling alternative offered by 3D integration. The 20nm TSV capabilities at Fab 8 are supplemented by GLOBALFOUNDRIES


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