April 26, 2012 — After pioneering low-cost wafer- and panel-based glass and silicon interposers in Phase 1 of its SiGI consortium, Georgia Tech Packaging Research Center (GT-PRC) is beginning Phase 2 in June.
The industry consortium involves about ~30 semiconductor, package, and related supply-chain companies from the US, Europe, and Asia. They developed glass and silicon interposers with 10x higher I/Os than conventional organic packages, at 2-10x lower cost per mm2 than back end of line (BEOL) silicon interposers.
SiGI Phase 1 has demonstrated technologies to:
- handle ultra-thin glass and silicon wafers and panels,
- form small through-package vias (TPV) at fine pitches with high throughput and high reliability,
- and make 5