“3.5D interposer technology could someday replace PCBs” — TSMC’s Doug Yu

May 14, 2012 — At the 15th Symposium on Polymers for Microelectronics (May 8-10 in Wilmington, DE), TSMC and Yole Developpement gave plenary presentations on the use of polymeric materials in wafer-level packaging (WLP) from foundry and overall industry perspectives.

The most controversial comment came from TSMC’s Doug Yu, senior director of front-end and back-end technology development, who challenged the current nomenclature and pronounced that the versatile interposer technology should be called

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