Wire bonder debuts with Cu wire optimization, automatic rethreading from ASM Pacific Technology

May 16, 2012 — The ASM iHawk Xpress Opto Wire Bonder from backend semiconductor assembly equipment supplier ASM Pacific Technology offers new innovations in transport, copper-wire bonding, and automatic rethreading.

The new wire bonder handles leadframes up to 100mm-wide on its improved transport. The larger leadframe-acceptance specification is designed to reduce transport times.

The bonder

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