David McCann of GLOBALFOUNDRIES to speak at The ConFab 2012 Solid State Technology is proud to announce that David McCann will speak at The ConFab 2012. The event will be held June 3-6, 2012 at The Encore at The Wynn in Las Vegas. David McCann is Sr Director for Packaging R&D at GLOBALFOUNDRIES in Malta, New York. In this role, Dave is responsible for Packaging R&D and back-end strategy and implementation. David will speak on the evolution toward silicon-based interconnect and packaging, which is having profound impact on how we think about technology development and the supply chain. “Previously, companies in incremental steps of the supply chain could develop products relatively independently,” he notes in his abstract. “Now they must work together to create solutions, or fail their common customers. Although the shortest path to market may be for the foundry to do everything in-house, the path to the best solutions that will enable competitive costs and high volume adaption will be flexible supply chains with collaborative partnering, flexibility, and transparency.” In a session focused on advanced packaging and progress in 3D Integration, David will be joined by fellow presenters Sandeep Bharathi, vice president of engineering, Xilinx; Ron Huemoeller, senior vice president, 3DAmkor; and Bill Chen, ASE Fellow and Sr. Technical Adviser, ASE Inc. The chair of the session is Abe Yee, Dir. Adv.Technology & Package Development, Nvidia Corp. Prior to GLOBALFOUNDRIES, David worked at Amkor Technology for 11 years, most recently leading the BGA, Flip Chip and MEMS product groups. He was responsible for extensions of package technology, bump, applications, and business performance. Prior to this, Dave was responsible for the fcBGA and fcCSP business group at Amkor. He led cross-functional teams in various areas including networking product strategy, mobile product development, large die/lead free flip chip development, and wafer level product strategy. David worked closely with Amkor factories in Asia. Prior to Amkor, David worked at Biotronik, GmbH in Portland, OR. Biotronik is a developer and manufacturer of implanted medical devices including defibrillators and pacemakers. David worked at Biotronik for 9 years and had various roles in Production, Process Engineering, Product Engineering, and Flip Chip implementation. His last role at Biotronik was leading the assembly, interconnect, and product transition from wire bond to flip chip. David has supported the Electronic Component and Technology Conference for more than 10 years. This year he is Conference General Chair.